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    44mythspromo
    EDA

    44 Myths About Chip Verification eBook (Download)

    Many misconceptions have emerged about chip simulation and verification tools and techniques. Download this eBook, which collects together four of our most popular 11 Myths articles...
    99100595 © Scanrail | Dreamstime.com
    alt.embedded

    Revitalizing U.S. Semiconductor Manufacturing

    The CHIPS Act is changing semiconductor manufacturing in the United States. What are foundries and fabless firms contending with to get the ball rolling?
    Siemens
    EDA

    Siemens Helps Understand Heat Inside 3D Chip Designs—and Out

    The company rolled out Calibre 3D Thermal to help deliver fast and accurate die-level thermal analysis of 3D IC designs.
    Ansys
    EDA

    Ansys Adds Another Dimension to the 3D Chip Design Process

    Learn how Ansys leverages NVIDIA’s Omniverse to unlock the future of 2.5D and 3D multi-die systems.
    Dreamstime_elen33_142387355
    Security

    Designing Defenses: How to Thwart Semiconductor Espionage

    The semiconductor industry’s technological advances make it a prime target for espionage, facilitating protective measures and design strategies to protect intellectual property...
    Nexa3D
    Industrial

    Unlock the Advantages of xESD for Electronic Components Carrier Fabrication

    xESD technology looks to boost semiconductor component manufacturing with improved resolution and static-dissipative properties while enhancing production and reducing costs.

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    TechXchange: Addressing Chip Verification Challenges

    Integrated circuits go through detailed verification before ever making a real chip, allowing developers to be confident that the chip will work once it's produced.
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    TechXchange: PCB Tools and Technology

    Check out the latest articles covering printed circuit board technology, methodologies, and development tools.
    Viasion
    Printed Circuit Boards

    5 Practical Strategies to Address PCB Miniaturization Challenges

    Tackling the top five PCB design challenges requires pragmatic strategies to handle smaller components on advanced boards.
    Heterogeneous 2
    EDA

    Heterogeneous 2.5/3D Chip Design Requires Integrated Tools

    Siemens’ Xpedition Substrate Integrator provides co-design prototyping and planning of 2.5/3D chips.
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    Analog

    Adopting AI-Based Circuit Optimization and Migration

    Analog designs are challenging, but artificial-intelligence optimizations are improving and speeding up the design process.
    Arm
    Embedded

    Arm Bets Big on AI with New Mobile CPU Cores

    The combination of X925, A725, and A520 cores, Arm’s most powerful mobile CPU cluster for AI to date, brings 46% better performance than CPU clusters based on the Cortex-X4 released...