Master Bond formulates high quality, innovative compounds for the assembly of semiconductor, electronics, energy, printed circuit board assemblies, and battery applications, specializing in conformal coatings, glob tops, flip chip underfills, and die attach materials. Our expansive line of epoxies, silicones, UV curable and LED curable compounds can be customized to meet a wide range of property requirements.
Performance Properties of Master Bond Adhesives, Sealants and Coatings
Specific compounds can be formulated to provide thermal management, heat transfer, thermal conductivity for pcb assembly, battery applications, sensors and components. Other formulations may provide EMI/RFI shielding, conformal coating, and encapsulants that protect against heat, moisture, contamination, vibration and shock. Yet other polymers may offer optical clarity, such as UV curables for opto-electronic applications.
