September 10, 2024
11:00 AM ET / 10:00 AM CT / 8:00 AM PT / 4:00 PM GMT
Duration: 1 hour
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Summary
Manufacturers of long-lifecycle systems (greater than 15 years) are grappling with supply chain challenges exacerbated by rapid component obsolescence. The COVID-19 pandemic further intensified these challenges, driving an increased demand for and acceptance of components from all available and authorized sources. This is particularly true for devices with older date codes.
Despite the growing consensus that restrictions based on date codes lack a factual foundation, some Original Equipment Manufacturers (OEMs) and Contract Manufacturers continue to express concerns about soldering aged material onto printed circuit boards.
Rochester Electronics presents its research findings on the success of board attachment versus the variation in traditional solderability tests for surface mount devices after extended storage periods as called out in the EIA/IPC/JEDEC joint standard J-STD-002.
There are better alternatives to conventional solderability tests when using aged components on PCBs. Find out the best way to address these issues:
- Discover an allowable alternative that more closely simulates board attach, providing a practical solution to this supply chain challenge.
- Explore how a long-term storage strategy can ensure a consistent supply chain backed by an in-depth examination of component solderability
Speakers
Neil He
Senior Quality Assurance Engineer
Rochester Electronics, LLC
Neil He is a Senior Quality Assurance Engineer at Rochester Electronics, working at its headquarters in Newburyport, Massachusetts. Since joining Rochester in 2021, his primary focus has been package qualification, new process introduction, and systems improvement for the Reliability lab. Neil holds a bachelor’s in chemical engineering from Case Western Reserve University.
Daniel Deisz
Vice President, Design Technology
Rochester Electronics, LLC
With over 35 years of semiconductor design experience, Dan Deisz is the Vice President of Design Technology at Rochester Electronics, based in Rockville, Maryland. In this role, his group performs all authorized product replications and customer-specific design solutions. Daniel is also an active member of the Anti-Counterfeiting Task Force (ACTF) for the SIA, having trained more than 200 CBP/HSI agents.
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