This article/video are part of the TechXchange: Cool Designs.
This presentation was given by Celsia's CEO, George Meyer, at ThermalLIVE in 2016.
Embedded electronics generate heat. Sometimes the amount of heat is significant and cannot be dissipated easily within the confines of a system. Fans and heatsinks can often mitigate thermal issues but in many cases more robust alternatives like heat pipes are needed to move the energy to a place where it can be dissipated effectively.
Celsia is a company that specializes in designing systems to handle these more challenging designs. Not all thermal solutions are the same and often they require custom implementations. Understanding the ins and outs of heat pipes and vapor chambers is a good starting point, especially if you're unfamiliar with the terminology and issues involved in designing such a system.
Chapters
- 0:00 - Making Hot Technology Cooler
- 6:03 - Phase Rules of Thumb
- 8.19 - Phase Similarity: Wick Structures
- 11:15 - Phase Device Similarity
- 13:42 - Phase: Effective Thermal Conductivity
- 14:53 - Phase Differences: Overview
- 17:54 - When Moving Heat to a Remote Sink
- 19:10 - When Spreading Heat to a Local Sink
- 22:51 - Bending & Shaping
- 28:48 - Heat Exchanger Designs (Fins)
- 29.32 - Assembly Attachment
- 30:25 - Thermal Solution Design Process
- 31:20 - Heat Sink Volumetric Calculation
- 34:25 - CFD Analysis and Prototyping