Electronic Design Innovators 2024

Over the years, Chuck Lewin has worked closely with his team to deliver motion-control ICs and boards that tackle the unique requirements of today’s machine designers.

The Briefing: Can traditional power electronics satisfy the rising power demands of AI chips in data centers?

Under the leadership of Maria Anhalt, Elektrobit has been collaborating closely with carmakers and technology partners to bring their visions for the cars of the future to life...

Field engineers help implement, deploy, and maintain technology in the field, driving innovation in areas primarily unseen.

Intelligence and the edge—what could possibly go wrong? Plenty, it turns out, whether it’s power limitations or security concerns, among other issues.

MEMS-based laser beam scanning (LBS) engines offer an alternative solution to current AR technology challenges, leading the way to stylish, lightweight, affordable, and powerful...

AI is already playing an increasing role in the engineering workplace, but is integration of AI an inevitability? Electronic Design’s Salary Survey brings this issue to light....

How did RISC-V transform from a student project into an architecture that’s being used by organizations, universities, and governments around the world? Let’s dive into the history...

What's kept Li-metal batteries from fulfilling their potential to be a viable intermediate technology between today's Li-ion cells and the solid-state batteries expected to eventually...

The never-ending upheaval of technology and electronics will continue unabated in 2024.

AI is already disrupting the product planning and development process—and it’s only getting worse.

Heat dissipation takes center stage in SOSA-aligned OpenVPX chassis. New methods of chassis cooling and the latest in backplanes are discussed.

Jim Handy’s crystal ball reveals trends about many topics, ranging from memory chips to generative AI.

Today’s connected society is immersed in radio waves. Literally a “sea of RF” and Wi-Fi sensing, enabled by advanced processing techniques, is emerging as a critical feature for...

Intel is looking to use glass, which has strong thermal and mechanical characteristics, as a substrate for chiplets.

Kirchhoff’s thermal law relating absorptive and emissive efficiencies has stood for over 150 years, but it may have some violations under specific circumstances.

Explore the main driving forces behind today’s multi-die systems, how they’re becoming the choice system architecture, and how they’re catalyzing the next wave of semiconductor...