Chip Packaging

Chip Packaging

This TechXchange examines chip packaging technology including new advances such as chiplets.

Oct. 19, 2023

Intel is looking to use glass, which has strong thermal and mechanical characteristics, as a substrate for chiplets.

March 7, 2021

Packaging: The new dimension of advancement in the semiconductor industry.

Feb. 19, 2021

Dr. Navid Asadi’s group provides an introduction to conventional chip packaging methods

Feb. 13, 2021

Dr. Navid Asadi’s group delves into chip packaging methods including system-in-package (SIP)

Feb. 12, 2021

Dr. Navid Asadi’s group examines how silicon interposers are changing chip packaging

More content from Chip Packaging

Feb. 11, 2021

Dr. Navid Asadi’s group examines 2.5D and 3D packaging for expanding capabilities and capacities of chip solutions

Feb. 8, 2021

Dr. Navid Asadi’s group examines chip package production

Feb. 4, 2021

Dr. Navid Asadi’s group delves into wafer scale and panel level chip packaging.

Nov. 4, 2013

We’ve come a very long way from the first IC, but we still have a long way yet to go to achieve the full promise of the IC revolution.

June 20, 2013

High-density BGAs and 3D stacking increase compute and storage density.